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Single wafer bonding test equipment Product List

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High-precision automatic alignment sheet lamination testing machine 'SE655aaBUP'

Backup method or mesh method! Position misalignment during adhesion can be controlled at the micro-meter level.

The "SE655aaBUP" is a high-precision automatic alignment laminating test machine with an alignment accuracy of ±0.01mm. It is capable of laminating glass + glass, glass + film, LCD + 3D film, and LCD + multifunctional glass, among others. Additionally, it employs an automatic alignment method using image processing with a CCD camera. Please feel free to consult us when needed. 【Features】 ■ Position misalignment during lamination can be controlled in micrometer units ■ Alignment accuracy ±0.01mm *For more details, please refer to the PDF document or feel free to contact us.

  • Other processing machines
  • Single wafer bonding test equipment

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